TELEDYNE IMAGING EXHIBITS ADVANCED TECHNOLOGIES AT VISION CHINA 2021

KUALA LUMPUR, March 4 (Bernama) -- Teledyne Imaging will exhibit at the upcoming three-day Vision China (Shanghai) at the Shanghai New International Expo Centre, beginning March 17.

Visitors to the combined Teledyne Imaging booth can expect to see a broad range of leading-edge line and area scan sensors, frame grabbers, vision systems, software, and smart cameras targeted at vision inspection, logistics, robotics and packaging applications.

According to a statement, the highlights include the industry’s first Multifield™ CMOS TDI camera, Teledyne DALSA’s award-winning Linea HS captures brightfield, darkfield, and backlit images at once in a single scan.

When combined with the Xtium™2 CLHS high-performance frame grabbers, these models achieve unmatched data throughput.

Teledyne e2v’s Emerald™ 67M image sensor achieves ultra-high resolution for electronics inspection, high-end surveillance and aerial imaging. Its 8K square resolution combined with its high frame rate enables increased throughput and improved detection ratio.

Also highlighted, Prime BSI Express camera’s small form factor and USB interface make it fit into the broadest range of configurations, while Kinetix camera’s 10-megapixel sensor provides a 29.4 mm field of view, opening up possibilities for new discoveries.

In addition, Teledyne’s first CXP camera and Teledyne Lumenera’s new Lt Series Cameras will also be highlighted at the event.

Teledyne Imaging, a group of leading-edge companies aligned under the Teledyne umbrella forms an unrivalled collective of expertise across the spectrum and decades of experience.

-- BERNAMA