DNP UNVEILS NEWLY DEVELOPED LEAD FRAME

KUALA LUMPUR, Oct 28 (Bernama) -- Dai Nippon Printing Co Ltd (DNP) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames that fix semiconductor chips and connect them externally.

In addition, the new technology improves adhesiveness with a surface roughening technology of the highest industry standard that seals the copper surface to the mold compound.

By providing this high definition, highly reliable lead frame the company aims to expand the use of semiconductor Quad Flat Non-leaded package (QFN) for vehicles, according to a statement.

DNP has taken advantage of its microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um.

It has also been possible to maintain high level reliability by improving the adhesion of the mold compound and the lead frame.

The Joint Electron Device Engineering Council (JEDEC) has established Moisture Sensitivity Levels (MSL) with the objective of preventing a variety of phenomena from volume expansion due to the absorption and vaporisation of air-borne moisture in the mold compound.

DNP is pleased to announce that its newly developed product has been verified the highest MSL 1 ranking.

DNP will propose the newly developed high definition, highly reliable lead frame to post-processing manufacturers and expand this business, while also strengthening its facilities to meet increasing demand, and plan to double production capacity by FY 2023 compared to FY 2020.

Since 1876, DNP is the worldwide leader in printing solutions and connects individuals and society, and provides new value.

-- BERNAMA