KIOXIA LAUNCHES ADVANCED UFS 4.1 MEMORY TO POWER SMARTER, FASTER AUTOMOTIVE SYSTEMS

_{UFS Ver. 4.1 Embedded Flash Memory Devices for Automotive Applications}

KUALA LUMPUR, July 31 (Bernama) -- Kioxia Corporation, a global leader in memory solutions, has commenced sampling of its latest Universal Flash Storage (UFS) Version 4.1 embedded memory devices, developed specifically for automotive applications.

The memory devices are made with Kioxia’s eighth-generation BiCS FLASH 3D flash memory and its in-house controller, delivering faster performance, better flexibility, and improved diagnostics for data-intensive vehicle systems.

Available in 128 gigabytes (GB), 256GB, 512GB, and one terabyte (TB) capacities, the UFS 4.1 chips are built to support a range of in-vehicle technologies including infotainment, Advanced Driving Assistant System (ADAS), telematics, domain controllers, and vehicle computers. They meet AEC-Q100/104 Grade 2 automotive standards and can operate in high temperatures environments of up to 115 degrees Celsius (°C).

In a statement, Kioxia said the 512GB UFS 4.1 device delivers a major performance leap over its previous UFS 3.1 generation, offering up 2.1 times faster sequential read, 2.5 times faster sequential write, and significant gains in random read and write speeds.

These improvements help create faster, more responsive experiences in next-generation vehicles.

The UFS 4.1 standard introduces advanced features such as WriteBooster Buffer Resizing and Pinned Partial Flush Mode, which enhance write performance and system flexibility. The devices are also backward compatible with UFS 4.0 and UFS 3.1, simplifying integration across existing platforms.

Enhanced diagnostic capabilities include a new vendor-specific device health descriptor, enabling predictive maintenance and more efficient monitoring—an essential feature for long-term automotive reliability.

These performance gains are made possible through CMOS directly Bonded to Array (CBA) technology, an architectural innovation that connects the CMOS circuitry directly to the memory array. This approach significantly boosts power efficiency, storage density, and data throughput—critical advantages for modern vehicles that depend on high-speed data processing.

Packaged in a JEDEC-standard format, the new UFS 4.1 devices are ready to be adopted by automakers looking to advance the performance, safety, and reliability of connected and autonomous vehicle systems.

-- BERNAMA